1NCE is a recognized standard for connecting low data products and now challenges the industry paradigm for high data IoT.
High data use cases like cameras can be connected the 1NCE Way for a single rate of $5 USD per GB worldwide.

1NCE, a company offering a software platform for connected products, today launched high data IoT for its customers for one global price with no hidden fees or commitments.

The announcement was made during the company’s presentation at Mobile World Congress in Barcelona.

1NCE has disrupted the IoT connectivity industry since 2018. Today, more than 18,000 customers around the world are using 1NCE’s software and connectivity services. Its lifetime license has been a perfect match for low data use cases such as smart metering, street lighting and asset tracking.

Now with the introduction of high data, even more use cases can be managed on the 1NCE platform. For $5 USD per GB, customers can connect their high data products – such as surveillance video and industrial monitoring – anywhere in the world with speeds up to 25 Mb/s. The single global price can be booked as a feature for customers on the 1NCE platform.

Kenny Hawk, Chief Executive Officer of Mojio: “1NCE made it so easy to setup IoT connectivity for Mojio’s video telematics global platform. Adding high data to their already impressive platform opens a new dimension for us to innovate and enhance the value of our data to make drivers safer, save time and save money.”

Ivo Rook, Chief Operating Officer at 1NCE: “Last year, our customers grew a staggering 42 percent, outperforming their competitors by rolling out more products across multiple countries with 1NCE. Opening our platform for high data was the next logical step to support their expansion.”

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Telit Cinterion, an end-to-end IoT solutions enabler, integrated Thales Instant Connect (TIC) services in its IoT modules for remote eSIM activation.
Comprised of a Thales eSIM with integrated TIC client, the solution enables instant worldwide activation of IoT eSIMs. It is extremely useful for industrial devices such as smart meters, security systems, healthcare equipment, and payment systems.
Aidon, a leading provider of advanced smart metering and smart grid solutions, is the first customer to deploy Telit Cinterion eSIM provisioning services with TIC.

Telit Cinterion IoT modules featuring Thales Instant Connect can be remotely activated for cellular connectivity at the time of device installation or during in-field operation.

This streamlines IoT deployments as it simplifies supply chain, device installation and maintenance, helping to keep IoT devices connected anywhere, and at all times. Aidon, a leader in smart metering solutions, is the first to benefit from this partnership and solution, deploying IoT modules and initial connectivity from a single vendor, Telit Cinterion.

By integrating Thales technology into Telit Cinterion modules, enterprises can enjoy instant out-of-the-box connectivity activation irrespective of the grid of available mobile networks. The collaboration between the two companies on this innovative solution enables them to get their IoT connected products in the market quickly, allowing them to reap the benefits of digital transformation that is at the core of the IoT promise.

The way the solution works is that, at the end of device production or when it is deployed in the field, the Telit Cinterion module uses the initial connectivity provided by Thales Instant Connect, to download the target local connectivity from the network operators selected by the IoT service provider. This allows device manufacturers and service providers to postpone selecting a connectivity provider until after the device is manufactured and throughout the deployment process. It can also be used during in-field operation, enabling deployed devices to stay connected throughout unexpected cellular network outages. This flexibility is particularly beneficial in situations where the devices are deployed across different regions or countries, as it allows for seamless integration with local network operators.

“Helping our enterprise customers to quickly launch and monetize IoT is our mission at Telit Cinterion. Adding the Thales eSIM to our modules in combination with our SIM provisioning and global MVNO services to streamline the final connectivity provider selection is a game changer in the industry. This powerful solution delivers unparalleled adaptability to changing circumstances and simplifies supply chain and logistics because it is based on a single eSIM with Thales Instant Connect, which can be shipped anywhere in the world,” said Manish Watwani, Chief Marketing and Product Officer at Telit Cinterion.

“The IoT eSIM solution is an important innovation, ensuring production flexibility and connectivity of our smart meters, even in rural areas, and all without the need for physical handling of SIMs. The solution provides a true operator selection and provisioning at any stage of the product lifetime. It is improving our ability to get smart meters connected, stay connected and adapt to new metering as-a-service business models,” said Petri Ounila, Director, IoT Devices, Aidon.

Guillaume Lafaix, Senior Vice President Mobile Connectivity Solutions at Thales, said:

“Thales aims to support IoT adopters and streamline device deployment with our eSIM with initial connectivity via Thales Instant Connect service. This simplifies and accelerates large scale IoT deployments for device makers, benefiting all stakeholders in the value chain. Thales is pleased to work with Telit Cinterion to support its success in cellular connectivity and speed up device deployment.”

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Silex SDIO/SPI Module Powered by Morse Micro MM6108 SoC Pushes the Boundaries of Wi-Fi HaLow Capabilities.

Silex Technology America, Inc., a global provider of leading wireless networking solutions, in collaboration with Morse Micro, the leading Wi-Fi HaLow silicon vendor, today introduced a new industrial-grade Wi-Fi HaLow module developed for Internet of Things (IoT) applications.

The new SX-SDMAH module combines the robust features of Silex’s wireless modules, renowned for their small form factor, extended temperature range, and product longevity, with Morse Micro’s MM6108 Wi-Fi HaLow SoC, which maximizes wireless range, coverage area and power efficiency for IoT devices.

This strategic partnership capitalizes on Silex Technology’s legacy of more than 40 years in hardware and software connectivity and Morse Micro’s pioneering role in developing Wi-Fi CERTIFIED HaLow solutions. Silex also offers turnkey services and the extended support needed to make Wi-Fi HaLow integration fast and seamless.

The SX-SDMAH module is designed to deliver unparalleled connectivity performance, with extended long range (more than 3 kilometers), ultra-low power consumption, and compatibility with numerous IoT applications, from smart homes to industrial automation. Target applications include Wi-Fi HaLow access points, gateways, Ethernet wireless bridges, Wi-Fi extenders, IP cameras, 3D scanners, GNSS receiver, vehicle telemetry devices, and high-end sensors.

“We’re proud to partner with Morse Micro to deliver next-generation Wi-Fi HaLow modules that will enable Wi-Fi CERTIFIED HaLow products for the growing global demand for long-range, low-power IoT connectivity,” said Satoru Kumashiro, senior product manager at Silex Technology America.

“Morse Micro is advancing the Wi-Fi HaLow market with best-in-class Wi-Fi HaLow SoCs that can extend the wireless connectivity of IoT devices to three kilometers, well beyond the reach of conventional Wi-Fi.”

“Silex is a pacesetter in wireless module solutions for the expanding IoT ecosystem, and we are delighted to partner with them in developing the new SX-SDMAH module,” said Phillip Kumin, SVP of Worldwide Sales and Business Development at Morse Micro.

“Our collaboration will accelerate time-to-market and simplify the development process for a wide range of IoT products based on the Wi-Fi HaLow IEEE 802.11ah standard. Together, we’re building momentum for Wi-Fi HaLow as the long-range protocol for IoT connectivity.”

Silex SX-SDMAH Wi-Fi HaLow Module Features (US Version):

Sub-GHz 802.11ah Wi-Fi HaLow radio module operating in the 902-928 MHz bands for the United States and Canada, with superior penetration of physical barriers
Long-distance wireless connectivity with 3 km range and large network capacity
1/2/4/8 MHz channel bandwidth support
Up to 32.5 Mbps PHY bit rate
Transmission power of +24 dBm
Access point and station mode
SDIO/SPI interface for Linux OS and SPI for FreeRTOS
Advanced security features including WPA3 and Wi-Fi Enhanced Open
Surface mount small form-factor module: 17 mm x 18 mm x 2.65 mm with integrated MHF-1 antenna connector
Industrial temperature range of -40°C to +85°C

Morse Micro’s comprehensive Wi-Fi HaLow portfolio includes the industry’s smallest, fastest and lowest power IEEE 802.11ah compliant SoCs. The MM6108 SoC supports 1, 2, 4 and 8 MHz bandwidth and can deliver tens of Mbps throughput to support streaming HD video. Morse Micro’s Wi-Fi HaLow SoCs provide 10x the range, 100x the coverage area and 1000x the volume of traditional Wi-Fi solutions.

Operating in the sub-GHz frequency band, the Wi-Fi HaLow IEEE 802.11ah standard was designed from the ground up for the IoT, offering an optimal combination of extended range, power efficiency, long battery life for wireless devices, superior penetration of barriers, large network capacity, advanced security, and Wi-Fi compatibility.

Availability

The SX-SDMAH module and evaluation kit are available now in the United States and Canada.

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Fibocom collaborates with STMicroelectronics to deliver the industry-leading smart home solution by integrating Microcontroller Unit (MCU) STM32WB55 of ST and the Matter-compatible 5G module FG370 of Fibocom into one 5G CPE, to realize the intelligent management of smart home devices such as light bulbs, speakers, tablets, switchers, etc. The solution drastically simplifies the access of smart home devices with unique, centralized, interoperable support for easy control of devices from the Matter-enabled platform.

Fibocom, a leading global provider of IoT (Internet of Things) wireless solutions and wireless communication modules, today announced the collaboration with STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, in launching the industry-leading smart home solution leveraging the Matter-compatible technologies, STM32WB55 and FG370.

It ensures the centralized control of smart home devices across different protocols, allowing smart home devices to interact smoothly.

In today’s landscape of smart home connectivity, one of the most challenging pain points is to connect devices made by different manufacturers without protocol barriers and enable these devices to communicate via the same “language” seamlessly. Connectivity Standards Alliance, the organization that maintains and publishes Zigbee and Matter standards, plays a crucial role in ensuring the interoperability of various smart home devices. Likewise, the implementation of the 5G network rollout has popularized the adoption of 5G FWA devices for flexible, reliable, and Gigabit in-home connectivity.

In collaboration with STMicroelectronics, Fibocom has integrated the smart home solution into 5G CPE in conjunction with ST’s MCU STM32WB55 and Fibocom’s 5G module FG370. The STM32WB55 supports the Bluetooth/Thread/Zigbee technologies, which is crucial for bridging the smart home devices as well as ensuring the interconnections between the devices in the application layer, providing flexible approaches Bluetooth+Thread and Bluetooth+Zigbee. By enabling 5G communication of the CPE, FG370 offers the docking of STM32WB55 through a UART peripheral, enabling the device “commissioning” on CPE. The alignment has significantly improved and opened up the imagination of future smart home automation and provided a comprehensive of conveniences for end users to control the smart home devices in a 5G CPE without redundant setups.

“Focusing on semiconductor technology innovation, ST is committed to providing customers with high-quality IoT connectivity solutions. We are glad to see ST’s MCU STM32WB55 being integrated in Fibocom’s 5G FG370 module, which enables our customers to build smart-home ecosystems on 5G CPE,” said Yin Yu, Marketing Manager, Wireless MCU Product at STMicroelectronics.

“The Alliance is committed to enabling the simplified, secure, and seamless interconnection of all objects, paving the way for a connected future. Through collaboration of our members STMicroelectronics and Fibocom, this goal is made simpler with 5G Fixed Wireless Access,” said Chris LaPré, Head of Technology at Connectivity Standards Alliance. “By launching this Matter-compatible smart home solution, which uses both companies’ integrated hardware design, they will soon bring this benefit to solution providers.”

“Fibocom joined Connectivity Standards Alliance as an adopter member last year, and we are committed to enabling and implementing superior in-home connectivity with highly compatible wireless module solutions. And we are glad that the collaboration with STMicroelectronics and Connectivity Standards Alliance will be well-addressed to scaling and accommodating a great number of smart home devices seamlessly and efficiently,” said Simon Tao, VP of MBB BU at Fibocom.

“In the future of smart home solution, we believe that the 5G FWA devices will emerge as the “Central Hub” for superior in-home connectivity, and we see the huge potential to empower the FWA devices with Matter-compatible hardware solutions. Looking forward, the partnership with the ecosystem will strengthen and tighten the acceleration of smart home solution in a unified platform.”

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Quectel Wireless Solutions, a global IoT solutions provider, and MediaTek have announced that the globally certified Quectel RG620T 5G module, based on the MediaTek T830 platform, and MediaTek BE7200 Wi-Fi7 modules, based on the MediaTek Wi-Fi7 chipset, have been adopted for mass commercial roll-out in Australia.

This deployment is the first commercial, massive volume production use case for the RG620T and will bring 5G fixed wireless access (FWA) to end users across Australia.

The Quectel RG620T is a series of 5G Sub-6GHz modules designed to support IoT and extended mobile broadband (eMBB) use cases. The module offers maximum data rates over 5G standalone networks of 7.01Gbps downlink and 2.5Gbps uplink. For non-standalone networks, the module offers data rate of 5.67Gbps downlink and 1.46Gbps uplink. Measuring 44.0 x 53.0 x 2.95mm, the module has an operating temperature range of -30 °C to +70 °C, with extended temperature variants also available. In addition, the module can be customized to meet the requirements of specific carriers.

“We’re delighted that the RG620T has passed the significant milestone of its first mass commercial roll-out and that modules are supporting the 5G needs of Australian fixed wireless access customers,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions.

“We’re proud to be contributing to the momentum behind 5G fixed wireless access as it delivers superior mobile experiences to users across the globe.”

The Quectel RG620T has been developed with carriers’ FWA needs in mind with use cases such as customer premise equipment, home and enterprise gateways and mobile hotspots prioritized. The MediaTek T830 system on chip has been selected because it features four high-performance ARM Cortex-A55 CPUs and can provide customer premise equipment with additional CPU capacity inside the modem. The MediaTek platform also allows for maximized cost effectiveness because the chipset is matched with a Wi-Fi solution thereby reducing cost if purchased at the same time. In addition, the MediaTek platform allows for cellular and Wi-Fi to co-exist in the same device, broadening its appeal and applicability.

Wi-Fi 7 offers a significant advancement in wireless technology, providing a multitude of benefits to consumers. One of its key advantages is higher throughput, which means faster data transfer speeds for streaming, gaming, and other online activities. This is complemented by the ability to handle more concurrent users without compromising the network’s performance, making it ideal for busy households or public spaces with many connected devices. Additionally, WiFi 7 boasts higher bandwidth, enabling the seamless handling of high-demand applications and services. It also integrates 5G capabilities, allowing users to leverage the strengths of both 5G and WiFi 7 for more innovative and demanding application scenarios.

“We’ve been working with Quectel as a long-term partner to explore pioneering technology and provide faster, more stable 5G products to markets across the world,” said Evan Su, General Manager of Wireless Communications Business Unit at MediaTek. “Our T830 and Filogic 680 chipsets provide the foundation for the Quectel RG620T and are now powering mobile broadband connectivity for users in Australia.”

Additionally, the T830 supports advanced features of 3TX (Transmit Antennas) and 8RX (Receive Antennas), which greatly enhances uplink and downlink speed, spectral efficiency, coverage quality and therefore delivers stable and super-fast 5G speeds even in complex indoor and outdoor environments. The T830’s 3TX and 8RX features fully comply with tier-one carrier roadmap and requirement. Quectel can also provide a module for the requirement for these features.

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Joint effort will apply advanced IoT technology to develop mobility services as infrastructure for daily life.

Soracom, Inc., a global provider of advanced Internet of Things (IoT) connectivity, and Suzuki Motor Corporation, which offers products in multiple mobility categories including automobiles, motorcycles, and outboard motors, today announced that they have signed an agreement to pursue applications of advanced IoT technologies in the field of mobility services.

The global automotive industry is changing rapidly, accelerated by broad progress in electrification and automation and by widespread consumer adoption of “connected car” or telematics-based capabilities. Automotive manufacturers now have the opportunity to apply recent advances in hardware, software, and connectivity to create new services and deliver new levels of comfort, convenience, and safety.

Together, Soracom and Suzuki will explore opportunities to collaborate in applying leading-edge IoT technologies to develop new offerings centered around mobility services. Potential focus areas include: electric vehicles (EVs) designed for the global market, modular “base units” and new technologies and services designed to support carbon neutrality.

Both companies will continue to work toward developing new mobility services that can provide the infrastructure for business and life in a sustainable society.

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