G+D and the telecommunications company China Unicom have signed a Memorandum of Understanding (MoU) at this year’s MWC to establish a strategic partnership in the areas of eSIM technology and services.

The agreement aims to establish a comprehensive and in-depth cooperation to promote the further development of eSIM technology and explore new use cases in vertical areas.

China Unicom has a strong market presence in the People’s Republic of China, especially in the fast-growing IoT sector. By partnering with G+D, a leading company in eSIM development, technology and management, China Unicom aims to drive the market introduction of eSIMs in various vertical segments. The partnership will help China Unicom to further consolidate and expand its market position by leveraging G+D’s technologies.

This important strategic partnership will enhance G+D’s reputation and visibility in the highly competitive Chinese market. Demonstrating its leading role in the eSIM sector, G+D will grow its market share in partnership with China Unicom.

By initiating this new collaboration, both companies are responding to the growing demand for technologies and services that support IoT scenarios. The range of applications for IoT solutions is virtually unlimited. They range from connected vehicles, smart logistics and smart grids to smart building, smart city and smart home applications. In particular, the Industrial Internet of Things (IIoT) is growing dynamically in Industry 4.0 scenarios such as smart manufacturing. The introduction of 5G will further accelerate this development. Billions of devices, machines, sensors and systems will soon be connected to the Internet in real time – the era of Massive IoT is beginning. The eSIM and remote SIM provisioning, also known as eSIM management, play a key role in this. They make the deployment and lifecycle management of IoT solutions simple and efficient.

“China Unicom has been approved to deploy eSIM applications in the fields of wearable devices, IoT, laptops, and tablets, becoming the only domestic operator supporting all developed areas in China. China Unicom will continue to strengthen eSIM ecosystem construction, leading the development of eSIM technology in China. Currently, the IoT field is entering a new stage of innovative development. At this point, we have signed this MoU with G+D to not only enhance collaboration based on decades of partnership but also to work together to promote the comprehensive application of eSIM across the industry, accelerating the implementation of eSIM solutions in various fields. I believe that this strategic collaboration will initiate a new era of innovation in eSIM,” said Fengwei Chen, Deputy General Manager from Unicom Vsens.

Simon Wakely, Global Head of Connectivity and IoT Sales at G+D, explained:

“With eSIM at the forefront, we are ready to pioneer the connected future. The partnership with China Unicom is a clear indication of our intention to continue to break boundaries with our innovative, flexible and secure IoT and connectivity solutions and to unlock the business potential for our customers. Together, we look forward to shaping a seamless, smart and inclusive future.”

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ABiT Corporation, a leading Internet of Things (IoT) device developer and solution provider, announces partnership with UnaBiz, a Massive IoT service provider and integrator, to enhance their technological offerings in the smart cities and logistics sectors in Japan and around the world.

The partnership will enable ABiT to create Sigfox-version of their IoT devices and solutions aimed at addressing the challenges facing smart cities and logistics industries. UnaBiz’s research and development team will support ABiT with expert engineering advice and essential documentation to ensure the seamless development and adaptation of devices.

The new line of Sigfox-ready solutions is targeted to be launched in Q4 2024, in markets within and beyond Japan through joint sales and marketing efforts. Existing customers of ABiT and UnaBiz will have priority access to the new solutions wherever they align with their technical requirements. UnaBiz will also promote ABIT’s made-in-Japan, high-quality IoT solutions to its network of 0G Operators present in more than 70 countries globally, supporting the adoption of market-defining Sigfox-enabled and multi-mode products and solutions.

Furthermore, both parties will engage in ongoing discussions to explore the development of Sigfox versions for bespoke products and projects, highlighting their long-term commitment to this partnership.

Takeo Hiyama, CEO of ABiT said, “UnaBiz and ABiT are complementary to each other: UnaBiz designs and markets Sigfox 0G Technology and has a strong distribution network through its Sigfox 0G Operators, while ABiT has excellent technical knowledge and experience to develop IoT devices and solutions on various LPWAN technology such as Sigfox, LoRaWAN and other cellular-based networks. We are looking forward to bringing Sigfox-enabled devices to market and promoting these products & solutions to our growing ecosystem of partners and customers.”

Alexis Susset, Group CTO of UnaBiz Group said, “UnaBiz’s approach towards LPWAN Convergence has paved the way for developing multi-connectivity devices, an area where ABiT’s capabilities shine. This partnership presents significant market potential for single-SKU, multi-mode solutions, demonstrating a strategic alignment to leverage the combined strength of both UnaBiz’s LPWAN convergence-ready Sigfox 0G Technology and ABiT’s LPWAN Products & Solutions within smart cities industries. Leveraging our global Sigfox operators footprint, the collaboration will enable both parties to expand our businesses and accelerate their go-to-market strategy in Japan and around the world.”

Together, they are also jointly designing and developing solutions at the forefront of government IoT use-cases innovation, paving the way for secure and localized implementations that address the unique challenges of the public sector.

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2023: First time, massive decrease in cellular module market shipments. Inventory normalization expected in 2nd half 2024.

The cellular non-handset device market is expected to decline significantly by 11.5% YoY in 2023 due to the inventory adjustments after supply chain disruption, inflation and demand decrease in 2022-2023. It is assumed that the impact of inventory adjustments will continue until the first half of 2024.

Industrial cellular module market (excluding automotive telematics) is estimated to decrease by 14.3% for the bigger the inventory in the whole supply chain. This is the first time decrease since 2009, we started to follow cellular module market. Complex supply chain from IC, module, distributor, and device OEM/ODM, makes it difficult to predict the inventory situation. However, suppliers expect that inventory normalize at some point in 2nd half of 2024.

Among non-handset cellular modem applications, only cellular CPE and automotive telematics showed steady growth in 2023. However, for automotive, tier-1 and tier-2 suppliers start to adjust IC chip inventory in late 2023, 2024 module demand is expected to soften.

Cellular Industrial/Automotive Module Market Forecast by Vertical Application

The cellular industrial and automotive module market grew significantly in 2021-2022. Yet, it is estimated to decline significantly by 12% on YoY in 2023. From the second half of 2022 onward, the decline in demand due to the economic downturn and excess inventory in relation to supply chain disruptions had an impact. Inventory adjustments are expected to continue until 1H/2024, and the market growth rate is estimated to be flat to low single-digit growth in 2024. Industry expects the recovery in 2H2024, then back to high single-digit growth after 2025.

The main uses of industrial cellular module are as follows in descending order:
Smart Meter (Electric, Gas, Water Meter): 25% (2023)
Transportation (Before/After-market Telematics, Vehicle Tracking, Train, Marine) : 22% (2023)
GPS Asset/Life Tracking (Logistics, Heavy Machinery, Livestock, Human…) : 15% (2023)
Payment/Retail (Point of Sales (mPOS), QR Code Payment, ATM, Vending Machine…) : 14% (2023)
Security/ Automation (Security Camera, Security Robot, Gate System, Alarm, Sensor) : 8% (2023)
Healthcare (Patient Vital Monitoring, Medical device monitoring, Vaccine management, smart pill box…) : 5% (2023)

Among Cellular industrial IoT applications, smart utility meters (25%), GPS tracking (telematics + transportation + asset tracking) together accounts over 60% market share in shipment volume base.

Other main applications include sharing economy (bike, e-scooter…), industrial computer, PoC (Push Over Cellular) handset, EV charging pile, smartphone charging pile, remote environment monitoring, smart agriculture, and so on.

Cellular M2M Market Forecast by Standard

Many Industrial IoT applications do not require broadband connectivity. On the other hand, wide area coverage and stability in connectivity is important.

Looking at the industrial M2M module market in 2023 by standard,

Cellular LPWA (LTE Cat.M and NB-IoT) decreased from 33% (2022) to just under 29% (2023).
LTE Cat.1/Cat.1 bis expands from 35% (2022) to 39%.
5G for automotive increased slightly. Market share will increase from 2022: 0.3% to 2023: 0.6%.
LTE will expand slightly from 21% (2022) to 23% (2023).

Trends after 2023 are as follows:

2G/3G to LTE Cat.1 bis migration in Europe and emerging markets
Decrease of NB-IoT in Chinese market, migration to LTE Cat.1 bis
Migration from LTE Cat.4/ Cat.1 bis to 5G RedCap in Chinese market
5G RedCap to be introduced in developed markets in 2026-2028
Migration from LTE Cat.M to LTE Cat.1 bis in some applications in Europe, North America, etc.
Migration from LTE to 5G in the automotive telematics

2G still has a market share of 7.6% in 2023. It is almost disappear in mature market, but still mainstream in South America, Africa, India and other emerging APAC countries. 2G will decrease to only 1% by 2029, migrate to LTE Cat.1 bis and LPWA.

LTE/ LTE-Advanced have a 23% share in 2023. It is widely used in the automotive, payment terminals, camera/video, industrial gateways, high end telematics, and so on. It will migrate to 5G eMBB/RedCap in the long run. The market share will decrease to just under 10% by 2029.

The market share of industrial 5G is only 0.6% in 2023. Private 5G/local 5G have been promoted in China and other developed markets, but they have not yet reached a large volume shipment. Excluding automotive telematics, the volume of 5G module shipments in 2023 is expected to be less than a million units. With the introduction of 5G RedCap, it is anticipated that the migration from LTE to 5G will progress in a wider range of applications. Thanks to the 5G RedCap market expansion, 5G will accounts about 17% of share in 2029.

LTE Cat.1 bis rapidly expanded in the Chinese market since 2021. In 2022-2023, Chinese low-cost LTE Cat.1 bis module has begun to be deployed in Europe, MEA, and APAC. It is expected that LTE Cat.1 bis will be introduced in Japan and USA from 2024. The market share of LTE Cat.1 + Cat.1 bis is estimated to increase to 39.3% in 2023 and exceed 50% in 2028-2029. Compared to LTE Cat.M/NB-IoT, the benefit of LTE Cat.1 bis is that it does not require base station upgrades. In the long term, LTE Cat.1 bis will migrate to 5G RedCap.

LTE Cat.M market is expected to see a decline first time in 2023 due to inventory adjustments. While demand is expected to decline in Europe and other countries, North America and Japan shows steady growth. The LTE Cat.M market share in 2022-2023 is approximately 10%. In 2029, it is estimated to grow to 11.5%. 5G eRedCap with 5MHz bandwidth operation is assumed to replace LTE-M in the long future.

The NB-IoT market turn to decline trend in 2023. In China market, competition between NB-IoT and LTE Cat.1 bis began in smart utility meter (gas, water) market in China. NB-IoT market is also expected to decrease outside China. Even in India, which is expected to become a large market for NB-IoT in the future, there is a possibility that LTE Cat.1 bis will take place of NB-IoT in the future.

Cellular Module & Modem Chip Market Share

In the industrial cellular module market, Quectel has about 39% of market share in 2023 based on shipments and 30% on a revenue basis. Quectel keeps top market share since 2017. Suppliers ranked second and below have a share of less than 10%, which is a big difference from Quectel. After Quectel, Telit-Cinterion, SunSea, Fibocom, ChinaMobile IoT, Neoway, ublox, Sierra Wireless, Rolling Wireless, MeiG accounts major share.

Since China market, which accounts over 50% of global cellular industrial module market, is occupied by local module suppliers, Chinese module suppliers counts about 83% of market share in shipment volume base. Among Chinese module suppliers, Quectel, Sunsea, Fibocom/Rolling Wireless also sells large number of cellular modules to overseas market.

The main module vendors by communication standard are as follows:

LTE: Quectel, Fibocom, Rolling Wireless, SunSea, MeiG, LG Innotek, Telit-Cinterion, WNC
5G: Quectel, MeiG, Fibocom, Sierra Wireless, WNC
LTE Cat.1 Global: Telit-Cinterion, Quectel, ublox、Sierra Wireless, Abit
LTE Cat.1 bis China: Quectel, Fibocom, SunSea, Neoway, MeiG, MobileTek, Lierda
LTE Cat.M: Telit-Cinterion, Quectel, u-blox, Sierra Wireless
NB-IoT Module: Quectel, ChinaMobile IoT, Lierda, MobileTek, SunSea, Goldcard, Luat

For cellular modem chipset for cellular M2M module, Qualcomm, UNISOC, Eigencomm, and ASR have a large share, followed by Xinyi, MediaTek and Sony Israel. In shipment volume base, Qualcomm is by far the largest (2023: 34%), and the three major Chinese companies each have a market share of 14-15%. Chinese chip suppliers, all together accounts about 55% of share in 2023.

The major chipset suppliers by cellular standard are as follows:

GSM: MediaTek, UNISOC
3G: Qualcomm
LTE: Qualcomm, Intel, Sanechips, ASR, UNISOC
5G eMBB: Qualcomm, UNISOC, HiSilicon
5G RedCap: HiSilicon, Qualcomm
LTE Cat.1 Qualcomm, Intel, Sequans
LTE Cat.1 bis: ASR, UNISOC, Eigencomm, AICXTek
LTE Cat.M: Qualcomm, Sony, ublox, Nordic, Sequans
NB-IoT: Eigencomm, Xinyi, UNISOC, HiSilicon, M-Link

Qualcomm is strong in high end (5G, LTE-Advanced) cellular modem segment. In the LTE market, Qualcomm still has a large market share, but ASR, UNISOC, and Sanechips are growing in low cost segment. The LTE Cat.1 bis and NB-IoT chipset markets, which have expanded in the Chinese market, are dominated by Chinese IC suppliers. There are no Chinese chip suppliers in LTE Cat.M market, which is not used in China. The 5G RedCap chipset, which will be diffuse in the Chinese market first, other than Qualcomm, Chinese IC suppliers such as HiSilicon, UNISOC, ASR, Innobase, Eigencomm, and AICXTek are expected to take major market share in the early stages.

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Fibocom announces the launch of the industry-first T300-based 5G RedCap Module FM330 series in collaboration with MediaTek during MWC Barcelona 2024. Expanding the landscape of 5G with MediaTek’s T300, the new RedCap module series features incomparable wireless performances in high transmission reliability, cutting-edge hardware density design, and excellent power efficiency. The FM330 series is positioned to expand the 5G landscape to a broader range, covering consumer-level, enterprise-level and industrial-level scenarios.

Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a new series of 5G RedCap module integrated with MediaTek’s T300 5G modem, which is the world’s first 6nm radio frequency system-on-chip (RFSOC) single die solution for 5G RedCap.

By integrating a single-core Arm Cortex-A3 processor in a significantly compact PCB area, the FM330 series are optimal solutions that offer extended coverage, increased network efficiency and device battery life for industry customers.

Compliant with 3GPP R17 standards, the FM330 series supports mainstream 5G frequency bands worldwide and is capable of reaching a maximum bandwidth of 20MHz, thus ensuring the peak data rate of up to 227Mbps downlink and 122Mbps uplink, sufficient to meet the demand for 5G applications with less data throughput while balancing the power efficiency. In hardware design, it adopts the M.2form factor measured at 30x42mm benefiting from the unique RFSOC solution integrated with T300, in addition to the optimized antenna design in 1T2R, which significantly saves the PCB area. Moreover, FM330 series is pin-compatible with Fibocom LTE Cat 6 module FM101, easing the concerns for customers’ migration from 4G to 5G. Furthermore, the module provides 64QAM/256QAM (optional) modulation scheme to greatly optimize the cost and size.

5G Dongle solution built-in with Fibocom 5G RedCap module FM330

5G dongles are gaining popularity in providing portable high-speed, ultra-reliable, and on-device connectivity anywhere, anytime, broadening the landscape of 5G FWA to more use cases. Fibocom’s FM330 series supports mainstream operating systems including Windows, Linux, and Android to match the diversity of terminals. Equipped with a standard USB peripheral interface, itis easy to access the internet with plug and play, and can be widely applied to terminal devices such as PC, tablets, drones, industrial routers, and more. Fibocom will leverage the one-stop 5G dongle solution to help customers adapt to the fast-growing marketplace and realize 5G monetization with less time to market.

“As a key part of the newly announced T300 5G modem, RedCap is a means for us to democratize access to 5G features, making it easier for customers to deliver a wide range of 5G-enabled IoT devices,” said Evan Su, General Manager of Wireless Communications Business Unit at MediaTek. “We’ve been working closely with Fibocom as a partner to ensure faster, more reliable 5G products around the world and power the next generation of connectivity.”

“We are honored to introduce the FM330 series with MediaTek at the world-class stage during MWC 2024, the T300 is an advanced chipset platform that is equipped with multiple cutting-edge designs and will be 100% integrated into Fibocom’s FM330 series modules,” said Simon Tao, VP of MBB BU at Fibocom.

“The exclusive and robust partnership we shared with MediaTek will reflect on the evolution of 5G towards next stage and beyond, and we have the confidence to expand the 5G adoption to a large-scale ecosystem with scalable, customized wireless solutions.”

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Quectel Wireless Solutions, a global IoT solutions provider, has unveiled a new portfolio of Wi-Fi 7 modules that are ideal for PC OEMs looking to support Wi-Fi 7 in their devices’ connectivity technology options.

The expanded Quectel Wi-Fi 7 and Bluetooth 5.4 modules range includes the Quectel NCM825, NCM825A, NCM835, NCM865 and NCM865A. All of the new modules offer support for Intel and AMD x86 platforms as well as the Snapdragon® X Elite platform for leading Windows PC experiences.

The Quectel NCM825, NCM835 and NCM865 series modules utilize a Qualcomm® FastConnect 7800 Mobile Connectivity system from Qualcomm Technologies and support simultaneous operation on the 2.4GHz plus 5GHz and 2.4GHz plus 6 GHz frequency bands thanks to 2 x 2 MIMO with dual band simultaneous (DBS) capability. The NCM865 and NCM865A chipsets feature High Band Simultaneous (HBS) technology, which enhances wireless communication by minimizing interference within the high-frequency spectrum. This advancement contributes to a more efficient use of bandwidth, resulting in decreased latency and an increase in data throughput. The modules also support multi-link operation (MLO), a feature that allows routers to use multiple wireless bands and channels at the same time to connect to a Wi-Fi 7 client. MLO enables the NCM8x5 series to achieve a faster data rate, much lower latency and higher network reliability for users.

“We’re delighted to bring further choice to PC OEMs by adding Wi-Fi 7 and Bluetooth 5.4 modules to our portfolio,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “By harnessing the performance of multi-link operation alongside dual band simultaneous capability we are able to ensure end users can access faster data with ultra-low latency while also continuing to experience outstanding network reliability. This widens the performance envelope for manufacturers and opens up rich experiences and greater flexibility for their customers.”

In addition, the new modules support 4K-QAM and 320MHz bandwidth which enables them to achieve a maximum data rate of 5.8Gbps, allowing the ultra-low latency and real-time response that laptop use cases demand. The modules also integrate and support dual Bluetooth, 2Mbps Bluetooth Low Energy (BLE), LE audio and BLE Long Range.

The Quectel NCM825 series measures 16.0mm x 20.0mm x 1.80mm, while the NCM865 series measures 22.0mm x 30.0mm x 2.25mm. The modules operate in the -10 °C to +65 °C temperature range and variants are certified by regulators across the globe.

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Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce its participation in the Mobile World Congress (MWC) Barcelona 2024, where it will showcase its IoT solutions alongside collaborations with industry-leading partners.

With a focus on IoT modules, antennas and services, Quectel will be showcasing the diverse capabilities of 5G technology and demonstrate its significant role in improving daily functions and user experiences across various sectors through a series of customer demonstrations. Attendees to MWC Barcelona will have the opportunity to explore the latest in 5G module technology, as well as a comprehensive selection of Quectel modules, encompassing Smart modules, GNSS, Bluetooth, Wi-Fi, and Satellite modules, complemented by corresponding antennas.

Quectel will also be introducing the Quectel RG255G, a 5G RedCap MediaTek-based module. The module, which is the world’s first 5G modem-RF system-on-chip (SoC), features MediaTek’s 5G RedCap UltraSave capability which results in 60% lower power consumption compared to existing 4G IoT modems, 70% lower power consumption compared to 5G extended mobile broadband (eMBB) modems and an additional 10% power saving with Release 17 power saving features enabled.

In addition, Quectel will unveil a new portfolio of Wi-Fi 7 modules that are ideal for PC OEMs looking to support Wi-Fi 7 in their devices’ connectivity technology options. The expanded Quectel Wi-Fi 7 and Bluetooth 5.4 modules range includes the Quectel NCM825, NCM825A, NCM835, NCM865 and NCM865A. All of the new modules offer support for Intel and AMD x86 platforms and Qualcomm’s SC8380XP Windows on Snapdragon (WoS) platforms.

“We’re thrilled to be at MWC Barcelona once again, showcasing not only best of Quectel modules and antennas, but also some of the innovative technologies that our products enable,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “Our presence at MWC Barcelona 2024 together with our customers’ applications is a testament to our dedication to innovation and our customers’ trust in us to lead the way in 5G technology.”

Attendees to the show will be able to experience the following demonstrations on the Quectel stand:

Teltonika 5G Router: In collaboration with Teltonika, Quectel is proud to display the new Teltonika 5G Router. This state-of-the-art router, highlighted by an impressive display panel provided by the client, represents a leap forward in high-speed, reliable internet connectivity for both commercial and residential applications.
MikroTik Chateau 5G Router: Quectel and MikroTik have teamed up to present the Chateau 5G Router, a device that epitomizes the fusion of sophisticated design and powerful 5G connectivity. It’s designed to cater to the growing demand for faster and more reliable home and office internet solutions with a quad-core ARM CPU, strong dual-chain dual-band wireless, 5x Gigabit Ethernet ports, powerful and durable built-in antenna, Linux container app support and 4×4 MIMO for the lower frequency range.
Broadcast Sports International: 5G MT-UHD: Quectel and Broadcast Sports International (BSI) showcase the 5G MT-UHD, an advanced 5G-enabled broadcasting tool that opens new horizons for live sports and events coverage. This collaboration highlights the transformative impact of 5G in the media and broadcasting industry.
Monitair MonAir-CO2: This unique environmental sensor is equipped with the advanced Quectel EG915U LTE Cat1bis module and YC0002AA antenna, making it a one-of-a-kind 4G battery-operated device capable of meticulously tracking CO2, temperature, humidity, COV, NOX, and noise levels.
CellBox Air 5G mmWave Radio Unit: Quectel and Microamp Solutions are teaming up to demonstrate the Cellbox Air 5G mmWave Radio Unit, a system that connects to the Distributed Unit (DU) through the O-RAN 7.2x interface and features an integrated Massive MIMO antenna array. This setup provides extensive coverage, rendering it an ideal option for both indoor and outdoor industrial applications.
PayEye eyePOS 3 – The world’s only terminal to support iris and facial biometrics fusion and all types of cashless payments – card, contactless (NFC) and mobile, featuring the QUECTEL SC668S-EM.
Consenz Head-up Display – Equipped with the Quectel SC680A module, this cost-effective retrofit Head-Up Display (HUD) solution from Consenz enhances driving safety. It offers a Head-Up Display that helps drivers maintain their focus on the road, a dash cam for detecting and recording objects, and a driver cam to ensure attentiveness and seatbelt usage.
ZCS Lawn Mower Robot: The ZCS autonomous lawn mower robot, powered by the Quectel LG69T Series module, an automotive grade dual-band multi-constellation GNSS module integrating DR/RTK, demonstrates the future of smart, connected landscaping. This robotic solution emphasizes efficiency, precision, and IoT connectivity, showcasing how GNSS technology can revolutionize garden maintenance.

Alongside these applications, Quectel will also be showcasing Particle’s newly launched “multi-radio” portfolio at the show, comprising the MSoM system-on-module, Muon development board, and Monitor M industrial equipment gateway, powered by Quectel modules.

These offerings are distinguished by their versatile backhaul options—Wi-Fi, LTE, NTN satellite, and LoRaWAN—augmented with additional radios for peer-to-peer connections, such as BLE 5.3 and sub-GHz for LoRa. Particle’s vision of “it works everywhere” will be on display, demonstrating a seamless operation across diverse environments, supported by our behind-the-scenes efforts in product development and strategic commercial relationships.

As part of the Quectel stand, Ikotek, a leading IoT original design manufacturer (ODM), will be demonstrating several end device applications including a 7-inch Android powered telematic control unit (TCU) specifically designed for motorcycles that uses a Bluetooth handlebar controller – developed by Carpe Iter. In addition, a modern 5G-indoor CPE, developed by Infinite Clouds WLL will be showcased at the booth. The device is based on Qualcomm chipset, offering high data throughputs of up to 4.0 Gbps via 5G networks.

Finally, Acceleronix, a global IoT solutions and services enablement provider primarily focused on serving OEMs and enterprises, will be taking part in MWC for the first time as part of the Quectel stand. Providing edge-device management software, Connectivity as a Service, vertical software and mobile applications, Acceleronix solutions are designed to activate and manage all aspects of IoT products, from development to data-management and visualization.

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