Edge Intelligence moves AI computing from the cloud to edge devices, where data is generated. Enabling terminals to be able to process and analyze the data on the device, reducing the need to transmit it to the cloud and gaining higher efficiency. Propelling edge intelligence of smart IoT terminals, Fibocom launches a high-performance smart module SC208 with global-scale 4G cellular mobile experiences and impressive multimedia processing capabilities during MWC Barcelona 2024.

Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a highly integrated multi-mode smart module SC208 with gigantic performance leaps in 4G category and a series of feature-packed multimedia experience improvements during MWC Barcelona 2024.

Powered by the Snapdragon® 460 mobile platform with an octa-core processor (4*A73 1.8GHz + 4*A53 1.6GHz) and with a high-performance graphics processing unit (GPU), the module is capable of multi-tasking in terms of 1080P video transmission, multi-camera input simultaneously while balancing the power consumption, bolstering the adoption of smart wireless solution in industries such as smart POS, industrial handsets, body-worn cameras, PoC terminals, in-vehicle applications, smart home and more.

Fibocom SC208 is designed to meet the evolving demand for edge intelligence for smart IoT terminals by integrating the Snapdragon 460 Mobile platform, supporting a 2x increase in overall system performance, compared to previous generations. Supporting MIPI DSI at 2520×1080@60fps and offering DDR4X in memory selection, SC208 brings multiple advancements in the overall performance. In hardware design, it adopts LCC+LGA form factor, allowing customers to migrate from Fibocom’s 4G smart module portfolio including SS808, SQ808, SC128, SU808, SC138 and SC228 smoothly. Furthermore, the 4G medium smart module is equipped with multi-constellation GNSS for precise location tracking service indoors and outdoors. Additionally, it pre-sets with an upgradable Android 14 operating system along with an extension of rich interfaces including MIPI/ USB/ UART/ SPI/ I2C, etc., enabling much flexibility and ease of integration to meet various application demands of the IoT industry.

“Qualcomm Technologies is thrilled to collaborate with Fibocom to help them advance the edge intelligence capabilities of smart IoT terminals. The launch of the SC208 module, powered by the Snapdragon 460 platform, brings impressive performance leaps and multimedia processing capabilities to the forefront,” stated ST Liew Vice President, QUALCOMM CDMA Technologies Asia-Pacific Pte. Ltd. and President, Qualcomm Taiwan region, South East Asia, Australia and New Zealand. “We are proud to support Fibocom in their mission to drive the adoption of smart wireless solutions across various industries. Together, we are facilitating the digital transformation with greater intelligence at the edge.”

Ralph Zhao, VP of MC BU at Fibocom, said:

“Edge intelligence is inevitably gaining prominence in the IoT industry ensuring higher productivity and processing of data-intensive tasks. The SC208 we launched today is positioned to empower the core of smart IoT terminals with highly integrated wireless solutions,”

“We are proud of our cooperation with Qualcomm Technologies and building the infrastructure of edge intelligence based upon Snapdragon 460 Mobile Platform. With greater capability landed on the edge, we are optimistic in our ability to facilitate the digital transformation with more intelligence.”

The SC208 will be ready for mass production in April 2024 for industry customers worldwide. Learn more about Fibocom’s smart module portfolio at booth #5I33 in hall 5 during MWC Barcelona 2024.

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Fibocom is delighted to announce the successful implementation of the 5G RedCap module solution, the cutting-edge innovation integrates with advanced 5G capabilities, to multiple application scenarios through collaborative efforts with industry partners from diversified segment markets. By achieving momentum across industries, the 5G RedCap module solution that Fibocom offers is capable of delivering a high-performance and cost-effective connectivity service for industry customers at the early stage of the 5G RedCap rollout.

Fibocom announces an industry-leading momentum of implementing deployable and commercialized 5G RedCap module solution to 5G IoT scenarios, in collaboration with well-known customers including but not limited to Askey, Quanta Computer, PLANET, companies of whom have profound influence in the vertical markets respectively.

Rigorous engineering testing and verification has been conducted to ensure the seamless integration of the latest generation 5G RedCap on customers’ devices. Enabling ultra-reliable data transmission and efficient network utilization under the 5G network catering to diverse application scenarios such as in-home connectivity, enterprises-level connectivity, and industrial-grade connectivity, etc.

Designed to offer a “lightweight” version of 5G and expand the proliferation of 5G in the IoT landscape, Fibocom has introduced a series of 3GPP R17 compliant 5G RedCap modules based on different chipset platforms, FG131, FG132, and FM330 during MWC Barcelona 2024. These RedCap modules are positioned to provide high-performance and cost-effective module solutions to industry customers fulfilling the smooth migration from 4G to 5G. It is worth noting that scalable form factor options are available for customers to adapt to the diversified market demands. Fibocom 5G RedCap module solution provides enhanced network performance, simplified hardware and antenna design while conserving low power consumption. By implementing Fibocom’s 5G RedCap module solution in customers’ terminal devices such as CPE, ODU, mobile hot-spot, dongle, industrial router, gateway, power equipment, in-vehicle smart device, camera, etc., allowing these devices to access 5G network in real-time and deliver superior data transmission performance in complex IoT environments, making it an ideal solution for the efficient management of business projects.

Askey Computer

“Askey is proud to partner with Fibocom on the development of the NR Lite 5G RedCap Camera, incorporating the advanced FG132 module. This collaboration represents a significant stride in our commitment to delivering top-tier networking solutions,” Said James Lee, BU Head of Camera R&D at Askey. “I am full of enthusiasm for this innovative outdoor camera designed to elevate video quality and provide global customers with unparalleled video services. With a range of accessories enhancing functionality, this collaboration aims to redefine the standards for 5G-connected cameras in outdoor environments.”

Quanta Computer Inc.

“Quanta and Fibocom have maintained a solid and close collaboration among LTE Cat1 to 5G solutions, build up a robust foundation for our partnership. While the upcoming RedCap market on the horizon, we are both poised for success. With the technical expertise and collaborative partnerships, Quanta and Fibocom are committed to deliver unique products and services, drive innovation in wireless communication industry and achieve the goal of expediting customer success.” Said Steve Cheng, VP & GM of Quanta Computer Inc.

PLANET Technology

“Aiming for the 5G infrastructure opportunities, PLANET continues to release a variety of 5G NR cellular communication solutions. The comprehensive product line includes the Industrial 5G IoT Fiber Gateway and the Industrial 5G NR Outdoor Unit (ODU) for harsh environments, the Enterprise 5G NR VPN Security Gateway and the 5G NR Compact Cellular Gateway. We believe that by applying Fibocom’s 5G RedCap module technology to PLANET already strong 5G cellular solution, we will be able to optimize product performance by providing high speed, low latency and secure data transmission. Making the deployment of 5G private network more flexible and cost effective. At the same time, satisfying the demand to accelerate industrial 5G private network deployment and IoT network.” Said Kent Kang, Senior Director of Product Engineering Department at PLANET.

“We are proud of the joint announcement of the commercially deployable 5G RedCap solution with our customers from diversified markets based on Fibocom’s 5G RedCap module portfolios. As an enabler in the ecosystem value chain, Fibocom will keep exploring the capabilities of 5G RedCap in the aspects of hardware design, network performance and power efficiency,” said Ronald Chan, VP of APAC Sales Department at Fibocom.

“We look forward to unleashing the full potential of 5G RedCap with our industry customers and helping customers to realize the monetization of 5G RedCap with less time to market.”

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G+D and the telecommunications company China Unicom have signed a Memorandum of Understanding (MoU) at this year’s MWC to establish a strategic partnership in the areas of eSIM technology and services.

The agreement aims to establish a comprehensive and in-depth cooperation to promote the further development of eSIM technology and explore new use cases in vertical areas.

China Unicom has a strong market presence in the People’s Republic of China, especially in the fast-growing IoT sector. By partnering with G+D, a leading company in eSIM development, technology and management, China Unicom aims to drive the market introduction of eSIMs in various vertical segments. The partnership will help China Unicom to further consolidate and expand its market position by leveraging G+D’s technologies.

This important strategic partnership will enhance G+D’s reputation and visibility in the highly competitive Chinese market. Demonstrating its leading role in the eSIM sector, G+D will grow its market share in partnership with China Unicom.

By initiating this new collaboration, both companies are responding to the growing demand for technologies and services that support IoT scenarios. The range of applications for IoT solutions is virtually unlimited. They range from connected vehicles, smart logistics and smart grids to smart building, smart city and smart home applications. In particular, the Industrial Internet of Things (IIoT) is growing dynamically in Industry 4.0 scenarios such as smart manufacturing. The introduction of 5G will further accelerate this development. Billions of devices, machines, sensors and systems will soon be connected to the Internet in real time – the era of Massive IoT is beginning. The eSIM and remote SIM provisioning, also known as eSIM management, play a key role in this. They make the deployment and lifecycle management of IoT solutions simple and efficient.

“China Unicom has been approved to deploy eSIM applications in the fields of wearable devices, IoT, laptops, and tablets, becoming the only domestic operator supporting all developed areas in China. China Unicom will continue to strengthen eSIM ecosystem construction, leading the development of eSIM technology in China. Currently, the IoT field is entering a new stage of innovative development. At this point, we have signed this MoU with G+D to not only enhance collaboration based on decades of partnership but also to work together to promote the comprehensive application of eSIM across the industry, accelerating the implementation of eSIM solutions in various fields. I believe that this strategic collaboration will initiate a new era of innovation in eSIM,” said Fengwei Chen, Deputy General Manager from Unicom Vsens.

Simon Wakely, Global Head of Connectivity and IoT Sales at G+D, explained:

“With eSIM at the forefront, we are ready to pioneer the connected future. The partnership with China Unicom is a clear indication of our intention to continue to break boundaries with our innovative, flexible and secure IoT and connectivity solutions and to unlock the business potential for our customers. Together, we look forward to shaping a seamless, smart and inclusive future.”

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ABiT Corporation, a leading Internet of Things (IoT) device developer and solution provider, announces partnership with UnaBiz, a Massive IoT service provider and integrator, to enhance their technological offerings in the smart cities and logistics sectors in Japan and around the world.

The partnership will enable ABiT to create Sigfox-version of their IoT devices and solutions aimed at addressing the challenges facing smart cities and logistics industries. UnaBiz’s research and development team will support ABiT with expert engineering advice and essential documentation to ensure the seamless development and adaptation of devices.

The new line of Sigfox-ready solutions is targeted to be launched in Q4 2024, in markets within and beyond Japan through joint sales and marketing efforts. Existing customers of ABiT and UnaBiz will have priority access to the new solutions wherever they align with their technical requirements. UnaBiz will also promote ABIT’s made-in-Japan, high-quality IoT solutions to its network of 0G Operators present in more than 70 countries globally, supporting the adoption of market-defining Sigfox-enabled and multi-mode products and solutions.

Furthermore, both parties will engage in ongoing discussions to explore the development of Sigfox versions for bespoke products and projects, highlighting their long-term commitment to this partnership.

Takeo Hiyama, CEO of ABiT said, “UnaBiz and ABiT are complementary to each other: UnaBiz designs and markets Sigfox 0G Technology and has a strong distribution network through its Sigfox 0G Operators, while ABiT has excellent technical knowledge and experience to develop IoT devices and solutions on various LPWAN technology such as Sigfox, LoRaWAN and other cellular-based networks. We are looking forward to bringing Sigfox-enabled devices to market and promoting these products & solutions to our growing ecosystem of partners and customers.”

Alexis Susset, Group CTO of UnaBiz Group said, “UnaBiz’s approach towards LPWAN Convergence has paved the way for developing multi-connectivity devices, an area where ABiT’s capabilities shine. This partnership presents significant market potential for single-SKU, multi-mode solutions, demonstrating a strategic alignment to leverage the combined strength of both UnaBiz’s LPWAN convergence-ready Sigfox 0G Technology and ABiT’s LPWAN Products & Solutions within smart cities industries. Leveraging our global Sigfox operators footprint, the collaboration will enable both parties to expand our businesses and accelerate their go-to-market strategy in Japan and around the world.”

Together, they are also jointly designing and developing solutions at the forefront of government IoT use-cases innovation, paving the way for secure and localized implementations that address the unique challenges of the public sector.

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2023: First time, massive decrease in cellular module market shipments. Inventory normalization expected in 2nd half 2024.

The cellular non-handset device market is expected to decline significantly by 11.5% YoY in 2023 due to the inventory adjustments after supply chain disruption, inflation and demand decrease in 2022-2023. It is assumed that the impact of inventory adjustments will continue until the first half of 2024.

Industrial cellular module market (excluding automotive telematics) is estimated to decrease by 14.3% for the bigger the inventory in the whole supply chain. This is the first time decrease since 2009, we started to follow cellular module market. Complex supply chain from IC, module, distributor, and device OEM/ODM, makes it difficult to predict the inventory situation. However, suppliers expect that inventory normalize at some point in 2nd half of 2024.

Among non-handset cellular modem applications, only cellular CPE and automotive telematics showed steady growth in 2023. However, for automotive, tier-1 and tier-2 suppliers start to adjust IC chip inventory in late 2023, 2024 module demand is expected to soften.

Cellular Industrial/Automotive Module Market Forecast by Vertical Application

The cellular industrial and automotive module market grew significantly in 2021-2022. Yet, it is estimated to decline significantly by 12% on YoY in 2023. From the second half of 2022 onward, the decline in demand due to the economic downturn and excess inventory in relation to supply chain disruptions had an impact. Inventory adjustments are expected to continue until 1H/2024, and the market growth rate is estimated to be flat to low single-digit growth in 2024. Industry expects the recovery in 2H2024, then back to high single-digit growth after 2025.

The main uses of industrial cellular module are as follows in descending order:
Smart Meter (Electric, Gas, Water Meter): 25% (2023)
Transportation (Before/After-market Telematics, Vehicle Tracking, Train, Marine) : 22% (2023)
GPS Asset/Life Tracking (Logistics, Heavy Machinery, Livestock, Human…) : 15% (2023)
Payment/Retail (Point of Sales (mPOS), QR Code Payment, ATM, Vending Machine…) : 14% (2023)
Security/ Automation (Security Camera, Security Robot, Gate System, Alarm, Sensor) : 8% (2023)
Healthcare (Patient Vital Monitoring, Medical device monitoring, Vaccine management, smart pill box…) : 5% (2023)

Among Cellular industrial IoT applications, smart utility meters (25%), GPS tracking (telematics + transportation + asset tracking) together accounts over 60% market share in shipment volume base.

Other main applications include sharing economy (bike, e-scooter…), industrial computer, PoC (Push Over Cellular) handset, EV charging pile, smartphone charging pile, remote environment monitoring, smart agriculture, and so on.

Cellular M2M Market Forecast by Standard

Many Industrial IoT applications do not require broadband connectivity. On the other hand, wide area coverage and stability in connectivity is important.

Looking at the industrial M2M module market in 2023 by standard,

Cellular LPWA (LTE Cat.M and NB-IoT) decreased from 33% (2022) to just under 29% (2023).
LTE Cat.1/Cat.1 bis expands from 35% (2022) to 39%.
5G for automotive increased slightly. Market share will increase from 2022: 0.3% to 2023: 0.6%.
LTE will expand slightly from 21% (2022) to 23% (2023).

Trends after 2023 are as follows:

2G/3G to LTE Cat.1 bis migration in Europe and emerging markets
Decrease of NB-IoT in Chinese market, migration to LTE Cat.1 bis
Migration from LTE Cat.4/ Cat.1 bis to 5G RedCap in Chinese market
5G RedCap to be introduced in developed markets in 2026-2028
Migration from LTE Cat.M to LTE Cat.1 bis in some applications in Europe, North America, etc.
Migration from LTE to 5G in the automotive telematics

2G still has a market share of 7.6% in 2023. It is almost disappear in mature market, but still mainstream in South America, Africa, India and other emerging APAC countries. 2G will decrease to only 1% by 2029, migrate to LTE Cat.1 bis and LPWA.

LTE/ LTE-Advanced have a 23% share in 2023. It is widely used in the automotive, payment terminals, camera/video, industrial gateways, high end telematics, and so on. It will migrate to 5G eMBB/RedCap in the long run. The market share will decrease to just under 10% by 2029.

The market share of industrial 5G is only 0.6% in 2023. Private 5G/local 5G have been promoted in China and other developed markets, but they have not yet reached a large volume shipment. Excluding automotive telematics, the volume of 5G module shipments in 2023 is expected to be less than a million units. With the introduction of 5G RedCap, it is anticipated that the migration from LTE to 5G will progress in a wider range of applications. Thanks to the 5G RedCap market expansion, 5G will accounts about 17% of share in 2029.

LTE Cat.1 bis rapidly expanded in the Chinese market since 2021. In 2022-2023, Chinese low-cost LTE Cat.1 bis module has begun to be deployed in Europe, MEA, and APAC. It is expected that LTE Cat.1 bis will be introduced in Japan and USA from 2024. The market share of LTE Cat.1 + Cat.1 bis is estimated to increase to 39.3% in 2023 and exceed 50% in 2028-2029. Compared to LTE Cat.M/NB-IoT, the benefit of LTE Cat.1 bis is that it does not require base station upgrades. In the long term, LTE Cat.1 bis will migrate to 5G RedCap.

LTE Cat.M market is expected to see a decline first time in 2023 due to inventory adjustments. While demand is expected to decline in Europe and other countries, North America and Japan shows steady growth. The LTE Cat.M market share in 2022-2023 is approximately 10%. In 2029, it is estimated to grow to 11.5%. 5G eRedCap with 5MHz bandwidth operation is assumed to replace LTE-M in the long future.

The NB-IoT market turn to decline trend in 2023. In China market, competition between NB-IoT and LTE Cat.1 bis began in smart utility meter (gas, water) market in China. NB-IoT market is also expected to decrease outside China. Even in India, which is expected to become a large market for NB-IoT in the future, there is a possibility that LTE Cat.1 bis will take place of NB-IoT in the future.

Cellular Module & Modem Chip Market Share

In the industrial cellular module market, Quectel has about 39% of market share in 2023 based on shipments and 30% on a revenue basis. Quectel keeps top market share since 2017. Suppliers ranked second and below have a share of less than 10%, which is a big difference from Quectel. After Quectel, Telit-Cinterion, SunSea, Fibocom, ChinaMobile IoT, Neoway, ublox, Sierra Wireless, Rolling Wireless, MeiG accounts major share.

Since China market, which accounts over 50% of global cellular industrial module market, is occupied by local module suppliers, Chinese module suppliers counts about 83% of market share in shipment volume base. Among Chinese module suppliers, Quectel, Sunsea, Fibocom/Rolling Wireless also sells large number of cellular modules to overseas market.

The main module vendors by communication standard are as follows:

LTE: Quectel, Fibocom, Rolling Wireless, SunSea, MeiG, LG Innotek, Telit-Cinterion, WNC
5G: Quectel, MeiG, Fibocom, Sierra Wireless, WNC
LTE Cat.1 Global: Telit-Cinterion, Quectel, ublox、Sierra Wireless, Abit
LTE Cat.1 bis China: Quectel, Fibocom, SunSea, Neoway, MeiG, MobileTek, Lierda
LTE Cat.M: Telit-Cinterion, Quectel, u-blox, Sierra Wireless
NB-IoT Module: Quectel, ChinaMobile IoT, Lierda, MobileTek, SunSea, Goldcard, Luat

For cellular modem chipset for cellular M2M module, Qualcomm, UNISOC, Eigencomm, and ASR have a large share, followed by Xinyi, MediaTek and Sony Israel. In shipment volume base, Qualcomm is by far the largest (2023: 34%), and the three major Chinese companies each have a market share of 14-15%. Chinese chip suppliers, all together accounts about 55% of share in 2023.

The major chipset suppliers by cellular standard are as follows:

GSM: MediaTek, UNISOC
3G: Qualcomm
LTE: Qualcomm, Intel, Sanechips, ASR, UNISOC
5G eMBB: Qualcomm, UNISOC, HiSilicon
5G RedCap: HiSilicon, Qualcomm
LTE Cat.1 Qualcomm, Intel, Sequans
LTE Cat.1 bis: ASR, UNISOC, Eigencomm, AICXTek
LTE Cat.M: Qualcomm, Sony, ublox, Nordic, Sequans
NB-IoT: Eigencomm, Xinyi, UNISOC, HiSilicon, M-Link

Qualcomm is strong in high end (5G, LTE-Advanced) cellular modem segment. In the LTE market, Qualcomm still has a large market share, but ASR, UNISOC, and Sanechips are growing in low cost segment. The LTE Cat.1 bis and NB-IoT chipset markets, which have expanded in the Chinese market, are dominated by Chinese IC suppliers. There are no Chinese chip suppliers in LTE Cat.M market, which is not used in China. The 5G RedCap chipset, which will be diffuse in the Chinese market first, other than Qualcomm, Chinese IC suppliers such as HiSilicon, UNISOC, ASR, Innobase, Eigencomm, and AICXTek are expected to take major market share in the early stages.

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Fibocom announces the launch of the industry-first T300-based 5G RedCap Module FM330 series in collaboration with MediaTek during MWC Barcelona 2024. Expanding the landscape of 5G with MediaTek’s T300, the new RedCap module series features incomparable wireless performances in high transmission reliability, cutting-edge hardware density design, and excellent power efficiency. The FM330 series is positioned to expand the 5G landscape to a broader range, covering consumer-level, enterprise-level and industrial-level scenarios.

Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a new series of 5G RedCap module integrated with MediaTek’s T300 5G modem, which is the world’s first 6nm radio frequency system-on-chip (RFSOC) single die solution for 5G RedCap.

By integrating a single-core Arm Cortex-A3 processor in a significantly compact PCB area, the FM330 series are optimal solutions that offer extended coverage, increased network efficiency and device battery life for industry customers.

Compliant with 3GPP R17 standards, the FM330 series supports mainstream 5G frequency bands worldwide and is capable of reaching a maximum bandwidth of 20MHz, thus ensuring the peak data rate of up to 227Mbps downlink and 122Mbps uplink, sufficient to meet the demand for 5G applications with less data throughput while balancing the power efficiency. In hardware design, it adopts the M.2form factor measured at 30x42mm benefiting from the unique RFSOC solution integrated with T300, in addition to the optimized antenna design in 1T2R, which significantly saves the PCB area. Moreover, FM330 series is pin-compatible with Fibocom LTE Cat 6 module FM101, easing the concerns for customers’ migration from 4G to 5G. Furthermore, the module provides 64QAM/256QAM (optional) modulation scheme to greatly optimize the cost and size.

5G Dongle solution built-in with Fibocom 5G RedCap module FM330

5G dongles are gaining popularity in providing portable high-speed, ultra-reliable, and on-device connectivity anywhere, anytime, broadening the landscape of 5G FWA to more use cases. Fibocom’s FM330 series supports mainstream operating systems including Windows, Linux, and Android to match the diversity of terminals. Equipped with a standard USB peripheral interface, itis easy to access the internet with plug and play, and can be widely applied to terminal devices such as PC, tablets, drones, industrial routers, and more. Fibocom will leverage the one-stop 5G dongle solution to help customers adapt to the fast-growing marketplace and realize 5G monetization with less time to market.

“As a key part of the newly announced T300 5G modem, RedCap is a means for us to democratize access to 5G features, making it easier for customers to deliver a wide range of 5G-enabled IoT devices,” said Evan Su, General Manager of Wireless Communications Business Unit at MediaTek. “We’ve been working closely with Fibocom as a partner to ensure faster, more reliable 5G products around the world and power the next generation of connectivity.”

“We are honored to introduce the FM330 series with MediaTek at the world-class stage during MWC 2024, the T300 is an advanced chipset platform that is equipped with multiple cutting-edge designs and will be 100% integrated into Fibocom’s FM330 series modules,” said Simon Tao, VP of MBB BU at Fibocom.

“The exclusive and robust partnership we shared with MediaTek will reflect on the evolution of 5G towards next stage and beyond, and we have the confidence to expand the 5G adoption to a large-scale ecosystem with scalable, customized wireless solutions.”

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