A new study from Juniper Research found the global number of IoT eSIM connections will near 1.3 billion by 2028, from 165 million in 2024.

This growth will be driven by emerging eSIM specifications that provide greater flexibility to enterprises to remotely provision eSIM profile switching over IoT devices.

The GSMA’s SGP.32 is the newest technical specification for eSIM remote provisioning for IoT devices, and enables the remote activation of eSIM profiles via an eIM (eSIM IoT Manager). Previous eSIM specifications caused network or user-interface constraints for IoT devices, as they relied on SMS for profile activation.

GSMA Standards to Increase IoT Opportunity

The study identified automotive, logistics, and oil & gas as the industries benefitting most from the introduction of the new specification. These industries, which require small form factors, are expected to account for over half of all eSIM-enabled IoT devices by 2028. The ability to ensure interoperable connectivity, enabled by SGP.32, is the key driving force for growth in these sectors.

It also anticipated the imminent arrival of further standards; noting SGP.42 as of key significance for stakeholders. SGP.42 provides similar functionality as SGP.32, but specifically for iSIM devices. iSIMs further reduce the form factor of devices, whilst retaining the same functionality.

Report author Elisha Sudlow-Poole remarked:

“Stakeholders must begin preparing for SGP.42 immediately, as iSIM standards become finalised. Standard-agnostic platforms that are flexible to upcoming form factors, certifications and use-case demands must be developed to capitalise on eSIM and iSIM market growth.”

The post Juniper Research: Emerging GSMA Specifications to Grow Global IoT eSIM & iSIM Connections by 680% over Next Four Years appeared first on IoT Business News.

TCL, a pioneer in display technology across feature-rich smartphones, tablets, and connected devices, launched today at MWC 2024, TCL LINKKEY IK511, one of the world’s first 3GPP R17 5G RedCap USB dongle powered by Snapdragon® X35 5G Modem-RF System from Qualcomm Technologies, Inc.

The product marks a significant milestone in the commercialization of the 5G RedCap for M2M (Machine to Machine) and consumer use cases, advancing TCL’s commitment to making 5G accessible for everyone, everything, everywhere.

5G RedCap is a new technology defined in 3GPP R17. It reduces costs and power consumption compared to 5G eMBB [1] which can help users quickly enjoy the convenience brought by 5G with less investment. This can liberate the 5G connectivity potential for wider application scenarios.5G RedCap will be the important momentum for the upcoming 5G deployments.

With the TCL LINKKEY IK511, TCL aims to expedite the deployment of 5G applications by promoting the adoption of the 5G RedCap. TCL LINKKEY IK511 is a perfect product for the M2M field, speeding up the industrial rapid development of digitalization.

“Qualcomm is enabling a world where everyone and everything can be intelligently connected. The Snapdragon X35 5G Modem-RF System, one of the first commercially available 5G RedCap modems, is advancing a unified 5G platform for IoT and entry tier broadband devices to help expand the 5G ecosystem to new devices, form factors and experiences. The TCL LINKKEY IK511 is an advanced implementation of RedCap that makes it easy and fast to bring 5G connectivity to new M2M devices and use-cases.” said Gautam Sheoran, vice president, product management, Qualcomm Technologies, Inc.

“TCL has been leading in the global MBB field for many years, we have always been committed to developing leading and practical products to help users around the world ‘connect the unconnected, create seamless connection.’ The TCL LINKKEY IK511 is amongst the first batch of 5G RedCap devices based on cutting-edge Snapdragon X35 Platform which can bring more potential for new 5G network. Together with Qualcomm Technologies, TCL will bring 5G to more customers and help to mark a new chapter in the future of connectivity and interconnected devices, to accelerate global connectivity.” said Jesse Wu, General Manager of Smart Connected Device at TCL Communication.

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During MWC Barcelona 2024, Fibocom is delighted to announce an industry-piloting innovation of its 5G premium smart module SC171 by implementing the capability of supporting Android, Linux, and Windows operating systems in the module. The new SC171 module solution will significantly improve the accessibility of different operating systems in the diversified 5G AIoT market worldwide.

Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, unveils the industry’s first 5G smart module solution that is compatible with Android, Linux and Windows operating systems, propelling the resilience of SoC-based wireless solution in the high-end AIoT market.

The solution is developed to adapt the diverse programming languages in the application layer and open convenience for software engineers in the field of industrial computers, smart retail payment terminals, in-vehicle infotainment tablets, and industrial cameras, robots, etc.

Powered by the Qualcomm® QCM6490 IoT solution, Fibocom SC171 is a premium 5G smart module that supports both 5G SA and NSA network architecture as well as 4X4 MIMO on the downlink and 2×2 MIMO on the uplink, delivering Gigabit wireless experience for edge computing scenarios. Featuring an octa-core (1*Kryo Gold plus 2.7GHz +3*Kryo Gold 2.4GHz+ 4*Kryo Sliver 1.95GHz) processor with visual Digital Signal Processor (vDSP), the SC171 provides superior processing capabilities of up to 12 TOPS of AI computing power. In addition, SC171 extends its excellence in multimedia performance thanks to the integration of the Qualcomm® Adreno 642L GPU, allowing maximum five-channel cameras working simultaneously, and dual-screen independent displays at 2520×1080@60fps, which are crucial for high-end AIoT applications that demand the utilization of upper-level computing power, 4K video decoding/encoding capability and 5G bandwidth.

In hardware configuration, SC171 is equipped with a comprehensive of advancements. It ensures flexibility and scalability for customers from different industries with the support of a set of rich interfaces including MIPI/ USB/ UART/ SPI/ I2C, etc. Most importantly, with the new enhancements in supporting three mainstream operating systems, SC171 is fully capable of meeting complex application scenarios and expanding in more diversified markets.

“As 5G, AI continues to reshape the AIoT applications, Fibocom will soldering the infrastructure of digitalization using its 5G + Edge AI connectivity solution and extensive industry know-how to increase the interoperability of industry customers from diversified market sectors,” said Ralph Zhou, VP of MC BU at Fibocom.

“By leveraging the three mainstream operating systems to our premium 5G smart module SC171, it will significantly hasten the deployment of AIoT applications, moreover, it will reduce the time for customers to develop a deployable solution to the market.”

Sequans Communications, S.A., leader in 4G/5G cellular IoT connectivity solutions, will be showcasing its newest chips and modules along with new Sequans-powered customer devices at Mobile World Congress, Barcelona, next week, February 26-29.

Sequans’ extensive experience in cellular IoT is reflected in its comprehensive product portfolio, covering NB-IoT/LTE-M up to 5G NR, and in its advanced features, which include industry-leading low power consumption, support for integrated eSIM, and global deployment capability. Here is an overview of what you will see from Sequans in hall 5, stand 5H40.

New products

5G Broadband: Taurus 5G NR

Taurus 5G NR is the industry’s first chipset perfectly dimensioned for broadband IoT with 1 Gbps speed. Taurus supports sub-6GHz radio (FR1) in both standalone and non-standalone 5G NR with 4G LTE fallback. It is an ideal solution for cost-effective 5G broadband applications, including fixed wireless access, portable hotspots, mobile computing, video surveillance and industrial IoT.

LTE Cat 4 Private and Public Networks: Cassiopeia

The Cassiopeia CA410 module combines support for 900 MHz and CBRS spectrum with USA public mobile network operator bands in a single, integrated solution. The multi-band module is designed for utilities and their OEMs who want to modernize their energy distribution networks. The solution gives them the flexibility to operate a private LTE network supporting 900 MHz and CBRS with the option to connect to commercial networks. Built in collaboration with Anterix and key collaborators GE Vernova, 4RF and RAD, the module is unique in the industry.

Coming soon

5G RedCap: Taurus LT

A new chip will enrich Sequans portfolio by supporting 5G NR RedCap (reduced capability) with fallback to LTE Cat 4. Taurus LT will expand the possibilities of cellular IoT applications and provide an affordable future-proof path to applications using LTE Cat 4 today.

In production

LTE Cat 1bis: Calliope 2

Supporting the optimized LTE Cat 1bis standard and designed for industrial IoT, this cost-efficient IoT technology offers seamless operation on any LTE network in any country while supporting speeds up to 10 Mbps. Ideal for trackers, security and alarm systems, payment systems, and industrial equipment, the Calliope 2 platform delivers a high level of reliability and security with support for VoLTE (voice over LTE).

LTE-M/NB-IoT: Monarch 2

Monarch 2 GM02S is a dual mode LTE-M/NB-IoT module that can dynamically switch between LTE-M and NB-IoT on demand and delivers highly advanced features, including industry-lowest power consumption at 1uA in deep sleep mode, global band support, a certified EAL5+ secure enclave for integrated eSIM, and an open SDK for customer applications. A variant, Monarch 2 GM02SP, supports GNSS, and Monarch 2 SiP features corrosion-free packaging, ideal for gas and water smart meters, and an ultra-small package. Monarch 2 modules are among the most widely deployed LTE-M solutions in the world today.

New products on display

New devices based on Sequans Monarch 2 LTE-M/NB-IoT technology that have never been displayed in public before will be in our showcase. These include a water meter from a leading smart meter maker, an overhead fault indicator from a leader in smart grid solutions, a fleet management solution from a global leader in connected transportation solutions, and two new wellness devices from a leader in ehealth solutions

The post Sequans at Mobile World Congress 2024: New products include 5G NR and 5G RedCap appeared first on IoT Business News.

Quectel Wireless Solutions, a global IoT solutions provider, today announces the Quectel RG255G, a 5G RedCap MediaTek-based module.

5G Redcap, which is short for reduced capability, is a 5G variant defined in 3GPP Release 17 that combines the low latency and reliability of 5G with features such as network slicing in a cost-competitive chipset design with a lightweight architecture. For deployments that would benefit from these attributes but do not need the full capabilities of 5G, RedCap provides an elegant and cost-effective option.

The module, which is the world’s first 5G modem-RF system-on-chip (SoC), features MediaTek’s 5G RedCap UltraSave capability which results in 60% lower power consumption compared to existing 4G IoT modems, 70% lower power consumption compared to 5G extended mobile broadband (eMBB) modems and an additional 10% power saving with Release 17 power saving features enabled.

“We’re delighted to announce the Quectel RG255G 5G Red Cap module which will enable customers to access many of the advantages of 5G without having to accept the full cost and power demands of the technology,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions.

“We see 5G RedCap enabling a wide range of IoT use cases and applications that demand ultra-reliable low latency communications (URLLC) and network slicing.”

The Quectel RG255G offers downlink performance of 220Mbps and uplink performance of 121Mbps on 256QAM or 91Mbps on 64QAM. Available in three form factors, LGA, M.2, Mini PCIe, the RG255G family operates in 20MHz bandwidth and offers support for LTE Cat 4 as well as GNSS. The modules also offer multiple interfaces including USB 2.0 and PCIe 1.0.

“The T300 series is the world’s first 6nm radio frequency system-on-chip (RFSOC) single die solution for RedCap,” said Evan Su, General Manager of Wireless Communications Business Unit at MediaTek. “We see RedCap as a key means to democratize access to 5G features, providing our customers with the ability to optimize components and deliver 5G enabled devices for a wide range of applications at various price points.”

The RG255G module is ideal for applications that include power monitoring, point of sale, industrial automation, smart energy and smart grid, mid-speed mobile broadband and wearable devices.

Quectel’s IoT modules are developed with security at the core. From product architecture to firmware/software development, Quectel incorporates leading industry practices and standards, mitigating potential vulnerabilities with third party independent test houses and have incorporated security practices like generating SBOMs and VEX files as well as performing firmware binary analysis into the entire software development lifecycle.

The RG255G series will be available alongside a series of antennas, providing developers with the ability to purchase module and antennas at the same time, reducing cost and time to market.

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State-of-the-art Telit Cinterion FE990B34/40 LGA module family driven by the latest and greatest 3GPP Release 17 5G chipset
High-power quad-core CPU delivers substantial processing power for customer applications

Telit Cinterion, an end-to-end IoT solutions enabler, announces the Telit Cinterion FE990B34/40 LGA family of modules, powered by the Snapdragon® X72 5G Modem-RF System from Qualcomm Technologies, Inc.

The trailblazing new modules feature a high-power quad-core CPU for optimal computing power as well as a wide variety of interfaces for maximum flexibility to integrate peripherals, signifying a remarkable leap forward in 5G connectivity.

Featuring the Snapdragon X72 chipset, designed to drive the next phase of 5G evolution enabled by 3GPP Release 17, the FE990B34/40 LGA family redefines connectivity on 5G NR, LTE, and WCDMA, empowering developers to create cutting-edge customer premise equipment (CPE), routers and gateways. Available in regional variants catering to either North America or the rest of the world, the modules offer support for two or three component carriers (CC), providing flexibility and compatibility while meeting diverse market requirements.

With a high-power quad-core ARM Cortex A55 @ 2.2 GHz baseband processor delivering unmatched processing capabilities, and running OpenWRT operating system with advanced networking features, the FE990B34/40 LGA family of modules allows customers to integrate their own software without the need for an external processor, while a wide variety of interfaces enable direct connections to up to three Wi-Fi transceivers and two Ethernet chips, providing maximum flexibility to seamlessly integrate peripherals, enhancing overall versatility.

The new modules also feature 5G sub-6 technology with gigabit LTE and WCDMA support, along with a highly advanced multi-constellation GNSS receiver. Ideal for ruggedized applications, these modules offer a compact footprint and rich features, making them suitable for high-performance enterprise and industrial applications, including indoor and outdoor fixed wireless access (FWA), video streaming and surveillance devices and mobile and industrial routers and gateways.

“Today marks the next chapter in our rich history of accelerating next generation technology adoption with leaders like Telit Cinterion,” said Gautam Sheoran, Vice President and General Manager, Wireless Broadband & Communications, Qualcomm Technologies, Inc. “Snapdragon X72 5G Modem-RF System delivers breakthrough 5G performance to the new FE990B34/40 LGA module family.”

“The FE990B34/40 LGA family of modules, backed by Qualcomm Technologies’ advanced 5G X72 and X75 chipset, is emblematic of the tremendous strides being made in 5G connectivity,” said Manish Watwani, Chief Marketing and Product Officer at Telit Cinterion.

“With unparalleled processing power and versatile interfaces, these new modules embody our dedication to pushing the boundaries of innovation in IoT solutions while empowering developers to create groundbreaking 5G-enabled devices.”

The post Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024 appeared first on IoT Business News.

Satellite IoT connectivity enables monitoring in remote forest locations.

Today, EchoStar Mobile Limited, an EchoStar company, announced that Dryad Networks has made an initial purchase of 3,000 EM2050 LoRaWAN® modules and related connectivity services.

The modules, powered by Semtech’s ultra-low power LR1120 device, will provide embedded LoRaWAN satellite IoT capabilities for the Dryad Silvanet Gateways. Dryad’s Silvanet Suite of groundbreaking end-to-end wildfire detection technology is already deployed in 25 countries by a wide range of public and private sector organizations.

“Each year, wildfires are responsible for 20% of global CO2 emissions and cause $140 billion of financial damages,” said Carsten Brinkschulte, CEO and Co-founder of Dryad Networks. “Dryad Networks is committed to protecting public and private forests with fire detection and monitoring solutions and the EM2050 module from EchoStar Mobile gives us the features we need to enable large-scale deployments in areas with poor or non-existent terrestrial network coverage. The EM2050 module made sense because of its compliance to LoRaWAN standards, the world’s largest IoT ecosystem. The EM2050’s latest features, such as Semtech’s Long Range – Frequency Hopping Spread Spectrum (LR-FHSS) technology coupled with EchoStar Mobile’s powerful satellite IoT communications infrastructure will provide excellent support for Dryad’s Silvanet wireless distributed architecture network.”

Prior to working with EchoStar Mobile, Dryad relied primarily on terrestrial connectivity with limited support for satellite communications. Integrating the real-time communications and dual mode connectivity of the EM2050 module into the upcoming 3rd generation of Sylvanet gateways will make it possible for Dryad to make full-featured use of satellite links, including support for bi-directional communications, device configuration and Firmware Update Over The Air (FUOTA), enabling deployments independently of terrestrial network coverage.

“We are thrilled to power the Silvanet product line with the EM2050 LoRaWAN compatible module,” said Telemaco Melia, VP and GM of EchoStar Mobile.

“Satellite connectivity is necessary to assure reliable and cost-effective 100% coverage. And the EM2050 module supports multicast and FUOTA, optimizing operations and keeping the Silvanet devices up to date.”

“We believe that satellite IoT holds immense potential in delivering significant benefits across various applications, in particular, those targeting environmental protection like Dryad’s Silvanet Suite,” said Carlo Tinella, Senior Product Marketing Manager at Semtech. “By providing affordable wireless connectivity in remote areas beyond the reach of terrestrial networks, it is possible to expand the digitalization process into vast natural assets, contributing to our planet’s sustainable development goals. We are enthusiastic about the outcome of this collaboration with EchoStar Mobile and believe the enablement of satellite technology for IoT leveraging LoRa® and LR-FHSS is just the beginning of a groundbreaking and transformative journey.”

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